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Freescale Semiconductor, Inc.
Advance Information
MC13190/D Rev. 1.2, 08/2003 2.4 GHz Short-Range, Low-Power Transceiver
MC13190
Package Information Plastic Package Case 1311 (QFN-32, 5x5 mm)
Freescale Semiconductor, Inc...
Ordering Information
Device MC13190FC Device Marking 13190 Package QFN-32
Contents
1 2 3 4 5 Introduction . . . . . . . . . . 1 Specifications . . . . . . . . 2 Contact Connections. . . 6 Application Information 8 Packaging. . . . . . . . . . . 14
1 Introduction
The MC13190 is a Short-Range, Low-Power 2.4 GHz ISM band transceiver. Together with an appropriate microprocessor or DSP for a Baseband Controller, it provides cost effective solutions for short-range (up to 10 meters), battery-powered data links. Applications include remote control, wire replacement, wireless audio, and wireless game control. The receiver includes a low noise amplifier (LNA), AM demodulator, band pass filter and limiting IF. The transmitter includes modulation control, baseband filtering and AM modulator. An on-chip PLL/VCO derives the RF frequency from a fixed 256 multiplication of the reference frequency. The device is fabricated using Motorola's RF BiCMOS process and is housed in a 32 lead QFN package with backside ground.
1.1 Features
* * * Typical Receiver Sensitivity: -71 dBm for 2x10-4 Bit Error Rate (BER) Typical Output Power = 4.8 dBm Fully Differential RF Input and Output
This document contains information on a pre-production product. Specifications and Pre-production information herein are subject to change without notice. (c) Motorola, Inc., 2003. All rights reserved.
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Electrical Specifications
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DEMOD_OUT_P DEMOD_OUT_N
DEMOD_BYPASS LNA_SW LNA_IN_P LNA_IN_N
LNA
Limiter 80 dB
AM Demod Baseband Filter RX_DATA RX_EN TX_EN
LNA_SW
LPF fref
Logic Interface
PLL_EN TRIM_EN LNA_SW FREF TX_DATA
1/256
o
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MOD_OUT_P MOD_OUT_N Modulator Modulation Filter
60% Modulation Control
Data
Figure 1. Simplified Block Diagram
2 Electrical Specifications
Table 1. Maximum Ratings
Rating Supply Voltage Signal and Control IC Contacts Demodulator Supply Voltage CW Input Power Gnd IC Contacts Voltage Capacitance Load at RX_DATA Storage Temperature Operating Temperature Tstg TA Demod_VCC Symbol VCC, VDD Value 3.2 3.2 4.1 7.0 0.3 10 -65 to 150 0 to 50 Unit V V V dBm V pF C C
NOTES: 1. Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in the Electrical Characteristics or Recommended Operating Conditions tables. 2. Meets Human Body Model (HBM) ) 2.0 kV and Machine Model (MM) 200 V except RFand Limiter circuit contacts. Limiter circuit contacts (contacts 19 and 17) = 900 V HBM, 125 V MM. RF Contacts = 80 V HBM, 50V MM. RF contacts have no ESD protection. Additional ESD data available upon request.
2
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Table 2. Recommended Operating Conditions
Characteristic Supply Voltage Digital Supply Signal and Control Contacts Demodulator Supply Voltage Input Operating Frequency Maximum Input Power into LNA_IN Symbol VCC VDD Min 2.5 2.0 80% VDD 2.47 2.411 4 Typ 2.75 2.75 3.1 50 25 5 Max 3.0 3.0 VDD 3.6 2.473 0 6 Unit V V V V GHz dBm Mbits/s
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Differential Load Impedance for Transmitter (MOD_OUT) Differential Source Impendance for Receiver (LNA_IN) Transmit Data Rate (Manchester Encoded) Transmit Data Encoding
Manchester, 50% Duty Cycle
Table 3. System Characteristics
(VCC = 2.75 V, TA = 25C, RF Receiver Frequency = 2.442 GHz, 60% AM, Bit Rate = 5.0 Mbps Manchester coded, tested in circuit shown in Figure 3, unless otherwise noted.) Characteristic Receiver Sensitivity for 2x10-4 Bit Error Rate Baseband Filter Lower Corner Frequency Baseband Filter Upper Corner Frequency Receiver Recovery Time from a 7.0 dBm Burst AM Modulation Depth Transmit Power (modulated) Receive Supply Current (Pin = -50 dBm) Transmit Supply Current Logic 1 Logic 0 50% Duty Cycle Standby Supply Current
NOTE:
Symbol
Min -65 50 3.0
Typ -71 0.35 6.0 60 4.8 11
Max 15 88 6.7 15
Unit dBm MHz MHz s % dBm mA mA
ICC ICC
-
-
54 27 40.5 51
50 215 A
Characterization data and design simulations guarantee functional operation from 2.3 to 3.2 V for VCC.
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Electrical Specifications
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Table 4. Receiver Section
tested in circuit shown in Figure 3, unless otherwise noted.) Characteristic Low Noise Amplifier and Am Demodulator Current Consumption Active Disabled Recovered Signal Level at -65 dBm Limiter and Level Shifter Current Consumption Active Disabled RX_DATA Drive Capability (5.0 MHz) Output High with respect to VDD_RX_DATA @ -100 A Output Low with respect to GND @ -100 A
NOTE:
(VCC = 2.75 V, TA = 25C, RF Receiver Frequency = 2.442 GHz, 60% AM, Bit Rate = 5.0 Mbps Manchester coded,
Symbol
Min
Typ
Max
Unit
-
11 7.0 5.0
-
mA A mVpp
A 80% VDD 0.2 240 3.0 10 pF V V
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Characterization data and design simulations guarantee functional operation from 2.3 to 3.2 V for VCC.
Table 5. Transmit Section
(VCC = 2.75 V, TA = 25C, RF Transmit Frequency = 2.442 GHz, 60% AM, Bit Rate = 5.0 Mbps Manchester coded, tested in circuit shown in Figure 3, unless otherwise noted.) Characteristic Symbol Min Typ Max Unit
Frequency Synthesizer (VCC = 2.75 V, TA = 25C, unless otherwise noted.) Total Current Consumption when active Active Disabled Frequency Range (FREF x 256) Reference Input Frequency RF Frequency Divide Ratio Trim Time (using fixed clock derived from reference) Time required to turn on and lock after trim (250 kHz Loop Bandwidth) Reference Input Level Ref Low Ref High fref N 2.4 9.375 10.2 1.1 256 25 2.484 9.704 100 s s mA A GHz MHz
VDD x 80%
-
VDD x 20% -
V
4
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Table 5. Transmit Section (Continued) (VCC = 2.75 V, TA = 25C, RF Transmit Frequency = 2.442 GHz, 60% AM, Bit Rate = 5.0 Mbps Manchester coded, tested in circuit shown in Figure 3, unless otherwise noted.)
Characteristic AM Modulator Current Consumption Active Disabled AM Modulation Depth Range Output Power Occupied Bandwidth (99% Signal Energy) [Note 1] Symbol Min Typ Max Unit
50 3.0 -
16.4 3.0 60 4.8 18
88 6.7 24
mA A % dBm MHz dBm
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Out of Band Spurious at Antenna Port [Note 1] 30 MHz to 2.4 GHz 2.5 to 12.75 GHz Acceptable Duty Cycle for TX_DATA Signal (Manchester Encoded)
48
-65 -60 -
-50 -45 52 %
NOTES: 1. Guaranteed by design, not tested. 2. Characterization data and design simulations guarantee functional operation from 2.3 to 3.2 V for VCC.
Table 6. Enable Logic Levels (VCC = 2.75 V, TA = 25C)
Symbol VIH VIL IIH IIL
NOTE:
Characteristic High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current
Min 80% VDD -
Max 20% VDD 1.0 A 1.0 A
Characterization data and design simulations guarantee functional operation from 2.3 to 3.2 V for VCC.
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Contact Connections
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3 Contact Connections
Table 7. Contact Function Description
Contact # Contact Name Ground Flag 1 2 3 4 MOD_VCC MOD_BUFF_VCC PLL_VCC LOGIC_VDD TX_DATA TX_EN PLL_EN FREF TRIM_EN VDD_RX_DATA GND VCO_VCC LPF LIM_GND_2 LNA_SW RX_OUT_DRVR_GND RX_DATA RX_EN LIM_VCC DEMOD_OUT_N DEMOD_OUT_P DEMOD_BYPASS DEMOD_VCC LNA_VCC LAN_IN_N GND DC Input DC Input Analog Input Digital Output Digital Input DC Input Analog Output Analog Output Digital Input DC Input DC Input DC Input DC Input DC Input Digital Input Digital Input Digital input Analog Input Digital Input DC Input Type Ground Modulator Supply Voltage Modulator Buffer Supply Voltage PLL Supply Voltage Digital Supply Voltage Transmit Data Input Enables TX Filter, Modulation Control and PA/Modulator circuitry Enables Frequency Synthesizer and VCO Reference frequency for PLL Enables VCO Trimming Limiter Output Supply Voltage Ground VCO Supply Voltage PLL Loop filter Ground Switches LNA Inputs to Ground in TX Mode Ground Received data output Enables LNA, Demod and Limiter Limiter Voltage Supply Negative output of Demodulator prior to Limiter Positive output of Demodulator prior to Limiter Bypass Capacitor for Demod Circuit Demodulator Circuit Supply Voltage LNA Circuit Supply Voltage Negative Input to LNA Ground Description
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5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
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Table 7. Contact Function Description (Continued)
27 28 29 30 31 32 MOD_OUT_N GND GND MOD_OUT_P GND LNA_IN_P Analog Input Analog Output Analog Output Negative output of Modulator Ground Ground Positive output of Modulator Ground Positive Input to LNA
Contact Connections
MOD_OUT_P
MOD_OUT_N
LNA_IN_P
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32 MOD_VCC 1 MOD_BUFF_VCC 2 PLL_VCC 3 LOGIC_VDD 4 TX_DATA 5 TX_EN 6 PLL_EN 7 FREF 8 9
TRIM_EN
31
GND
30
29
GND
28
27
26
25 24 LNA_VCC 23 DEMOD_VCC 22 DEMOD_BYPASS 21 DEMOD_OUT_P 20 DEMOD_OUT_N 19 LIM_VCC 18 RX_EN 17 RX_DATA
10
VDD_RX_DATA
11
GND
12
VCO_VCC
13
LPF
14
LIM_GND_2
15
LNA_SW
16
RX_OUT_DRVR_GND
Figure 2. Contact Connections
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LNA_IN_N
GND
GND
7
Application Information
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4 Application Information
Figure 3 shows the basic transceiver evaluation board circuit schematic with reference oscillator and Figure 4 shows the optional external LNAs. Figures 5 and 6 show the evaluation board printed circuit board layout details. This realization is intended for device evaluation and has been designed with a 50 interface. C19, C20, L10 and L12 form a lumped-element balun. In equipment applications a differential antenna can be interfaced through matching elements directly to the LNA and Modulator contacts. A PCB dipole antenna board with balun and SMA connector is available for link evaluations. A version of the board which includes a dipole antenna is also available. The RF circuit layout is critical and should be duplicated exactly. In normal applications, the entire transceiver should be shielded and control lines from the baseband should be as short as possible. The optional external LNA circuits require an external differential switch that is implemented with PIN diodes D1, D2, D3 and D4. T1 and T2 are quarter wave lines for isolation. IC Contact 15, LNA_SW, is grounded since the internal switch is not used. If the LNA are used, C25 and C30 are not placed and "zero Ohm" resistors R5, R9, R13 and R14 insert the LNAs into the receive path. Voltage supply Contacts 1, 2, 3, 12, 19, 23 and 24 require bypass capacitors as close as possible to the device. Logic supply Contact 4 can directly interface to the baseband supply in equipment applications. The DEMOD_BYPASS (Contact 22) bypasses the demodulator bias circuitry for both RF signals and low frequency signals. The differential demodulator output from contacts 20 and 21 is available at TP1 and TP2. The PLL loop filter is the standard R+C // C network and connects between contacts 12 and 13.
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Freescale Semiconductor, Inc.Application Information
RF_IN
J5 C19 L12 C20 L10
2.7/2.75 V
C32
TX_EN R21 L2 L3
C17
C31
2.7/2.75 V
C11
T1
D3
D4
T2
C16
D1 L1
C13
C14
D2 L4 R13
A To Optional LNA #1 B
R5 C25 R9 L7 C12 2.7/2.75 V U1 C15 L11 C30
C To Optional LNA #2 R14 D
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C6 32 31 30 29 28 27 26 25 24 R4 C18 C5 22 21 20 19 18 * Backside ground contact soldered to PCB 9 10 11 12 13 14 15 16 TP1 Connected TP2 to via R20
2.7/2.75 V 2.7 - 3.3 V
2.7/2.75 V
C1
R15 1 2 3 4
MC13190
23
C21 R2 C8 C9 Y1 C7 R3 Q1
C38 2.7/ 2.75 V C33 R16
5 6 Jumper C4 7 8
R19
2.7/ 2.75 V
*
C36
17
N.C. 2.7/2.75 V
VCO_VCC
R18 R17 VCO_VCC
L5 R1 C2 C3 C37
C34
C35
N.C.
2.7/2.75 V
N.C. TX_EN
Figure 3. Transceiver Application Circuit Schematic
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Application Information
Optional LNA #1
C23
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Optional LNA #2
RX_EN R7 C27 R11 RX_EN
R8 R6 L6 C24 L13 C22 C10 C29 L9 R12
R10
L8 C26
Q2
A
C
C28
Q3
B
D
Figure 4. Optional LNA Circuits Table 8. Bill of Materials
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Reference C1, C6, C11, C16, C18, C21, C33, C35, C36, C37 C2 C3 C4, C23, C27 C5 C7, C8 C9, C34 C10, C13, C14, C29 C12, C15 C17 C19, C20 C22, C28 C24, C26 C25, C30, C31, C32, C38 D1, D2, D3, D4 J2, J3, J4 J5 L1, L4 L2, L3 L5 L6, L7, L8, L11 L9, L13
Value 0.1 F 82 pF 12 pF 1000 pF 1.0 F 27 pF 100 pF 6.0 pF 3.0 pF 10 pF 1.5 pF 0.5 pF 2.0 pF 33 pF BAR63-03W
Description 0402 Ceramic, Murata 0402 NPO Ceramic, Murata 0402 NPO Ceramic, Murata 0402 Ceramic, Murata 0603 Ceramic, Murata 0402 NPO Ceramic, Murata 0402 NPO Ceramic, Murata 0402 NPO Ceramic, Murata 0402 NPO Ceramic, Murata 0402 NPO Ceramic, Murata 0402 NPO Ceramic, Murata 0402 NPO Ceramic, Murata 0402 NPO Ceramic, Murata 0402 NPO Ceramic, Murata Pin Diode, Siemans 1 x 10 Header Strip SMA Right Angle
2.2 nH 15 nH 2.7 nH 3.0 nH 0.5 nH
0402 Toko 0402 Toko 0603 Toko 0402 Toko 0402 Toko
10
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Table 8. Bill of Materials (Continued)
Reference L10, L12 Q1 Q2, Q3 R1 R2 R3 R4 12 k 560 68 k 51 0 49 k 130 180 10 270 Z0 = 25 , = 0.72 Value 1.8 nH Description 0402 Toko MMBT3904 MBC13900 0402 5% 0402 5% 0402 5% 0402 5% 0402 0402 5% 0402 5% 0402 5% 0402 5% 0402 5% Microstrip Transmission line, r = 4.5 mils, t = 10 mils MC13190 9.357 MHz Temex
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R5, R9, R13, R14 R6, R12 R7, R11 R16, R17, R18 R8, R10, R15, R19, R20 R21 T1, T2 U1 Y1
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Application Information
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2.0"
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2.25"
Figure 5. Transceiver Circuit PCB Topside (Active Dielectric = 10 mil FR4, Total Board Thickness = 0.062")
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2.0"
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2.25"
Figure 6. Transceiver Circuit PCB Bottom Side (Active Dielectric = 10 mil FR4, Total Board Thickness = 0.062")
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Packaging
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5 Packaging
PIN 1 INDEX AREA 0.1 A 0.1 2X C 0.1 G 1.0 0.8 5 (0.25) 0.05 0.00 (0.5) C DETAIL G VIEW ROTATED 90 CLOCKWISE M B 0.1 C 3.25 2.95 EXPOSED DIE ATTACH PAD 25 32 A B DETAIL M PIN 1 INDEX SEATING PLANE 1.00 0.75 0.05 C 5 C 5 2X M C
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24
1 0.25
NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 3. THE COMPLETE JEDEC DESIGNATOR FOR THIS PACKAGE IS: HF-PQFP-N. 4. CORNER CHAMFER MAY NOT BE PRESENT. DIMENSIONS OF OPTIONAL FEATURES ARE FOR REFERENCE ONLY. 5. COPLANARITY APPLIES TO LEADS, CORNER LEADS, AND DIE ATTACH PAD. 6. FOR ANVIL SINGULATED QFN PACKAGES, MAXIMUM DRAFT ANGLE IS 12.
3.25 2.95 0.1 C A B 0.217 0.137 17 8 N 16 32X 0.5 0.3 9 32X 0.30 0.18 0.1 VIEW M-M 0.05 M M C C DETAIL S PREFERRED BACKSIDE PIN 1 INDEX (45 5 ) DETAIL S A B (0.25) (0.1) 0.5 28X 0.217 0.137
(1.73)
0.60 0.24
32X
0.065 0.015
(0.25) DETAIL N PREFERRED CORNER CONFIGURATION 4
0.60 0.24 DETAIL N CORNER CONFIGURATION OPTION 4 DETAIL M PREFERRED BACKSIDE PIN 1 INDEX
DETAIL T 0.475 0.425
1.6 1.5
5
BACKSIDE PIN 1 INDEX
(90 )
2X
0.39 0.31
R
0.25 0.15 DETAIL M BACKSIDE PIN 1 INDEX OPTION DETAIL T BACKSIDE PIN 1 INDEX OPTION
2X
0.1 0.0
DETAIL M BACKSIDE PIN 1 INDEX OPTION
Figure 7. Outline Dimensions for QFN-32, 5x5 mm (Case 1311-03, Issue E)
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HOW TO REACH US: USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217 1-303-675-2140 or 1-800-441-2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu Minato-ku, Tokyo 106-8573 Japan 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong 852-26668334 TECHNICAL INFORMATION CENTER: 1-800-521-6274 HOME PAGE: http://www.motorola.com/semiconductors
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MC13190/D
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